Customized Tensilica-based Embedded Systems Now Available at Any Volume

SANTA CLARA, CA, – November, 26, 2007 – Tensilica®, Inc and eASIC Corporation today announced a partnership to remove the cost barriers for developing custom embedded System-on-a-Chip. (SoCs). Through this partnership eASIC now provides free access to Tensilica’s Diamond Standard microprocessor and DSP cores for its free mask charge, no-minimum order ASICs. This unique combination enables embedded system designers to develop Diamond processor-based SoCs for applications in any production volume. Designers will now be able to develop customized, highly differentiated ASIC solutions at a lower cost than FPGA-based embedded systems. Read the rest of this entry »

eASIC’s Nextreme Product Family is Added to AAI’s line-card to Combine the Benefits of FPGAs and Cell-based ASICs

Santa Clara, California, and Tel Mond, Israel, August 8, 2007 – eASIC Corporation, a provider of Structured ASIC devices, and Avnet ASIC Israel (AAI), a provider of ASIC and COT design and manufacturing services, announced today a partnership to deliver eASIC’s breakthrough Structured ASIC technology to the Israeli marketplace. The partnership agreement will enable AAI to offer low-power, low-cost (zero mask cost) and short turnaround 90nm Structured ASICs. Under the agreement, AAI will provide design, technical and sales support to customers using eASIC’s products in Israel. Our partnership with Avnet-ASIC Israel is part of our global sales expansion plan, to meet the increasing demand for a fast-turn yet cost-effective custom design solution, such as eASIC Nextreme Structured ASIC, said Fred Lancia, Vice President of Sales for eASIC. eASIC is pleased to join forces with a leading design and turnkey manufacturing services. Our goal is to broadly introduce our breakthrough Structured ASIC solution and provide our growing Israeli customer-base with world-class sales support and customer service. Read the rest of this entry »

eASIC’s Nextreme Threatens FPGA and ASIC Technologies

Newbury, UK, 25 June, 2007 – Abacus Group today announced that it has signed an agreement with eASIC Corporation, a provider of Structured ASIC devices, to offer UK FPGA, ASIC and embedded systems designers with a low power consumption, low unit cost and zero NRE alternative technology. Read the rest of this entry »

The New kit comes Complete with Development Board and Supporting Embedded Design tools, that Enable Parallel Development of Software and Hardware for SOCs

SANTA CLARA, Calif., May 22, 2007 – eASIC Corporation, a provider of Structured ASIC devices, and IAR Systems, a provider of embedded development tools, today announced the immediate availability of the e926 Development Kit for designing affordable ARM926EJ-based embedded systems. The e926 Development Kit provides embedded system designers with a comprehensive application development environment. The kit includes eASIC’s e926 development board, IAR Systems’ software design and debug tools, as well as AMBA peripherals and reference designs that enable designers to start developing their software applications within 30 minutes. Read the rest of this entry »

Premier will Leverage its Experience and Strong Customer base to Broaden the Reach of eASIC’s Innovative yet Affordable Custom Logic Products

Santa Clara, California, May 14, 2007 – eASIC Corporation, a provider of Structured ASIC devices, today announced that it has entered into partnership agreement with Premier Technical Sales, a leading high-tech manufacturers’ representative of major global electronic suppliers. With this partnership, eASIC further expands its global sales channel organization to provide extensive commercial and technical support in North America for its eASIC Nextreme Structured ASIC products. Leveraging its semiconductor market experience, Premier will support the rapid customer demand of eASIC Nextreme Structured ASICs. Read the rest of this entry »

With Comprehensive Experience in ASIC, FPGA and ASSP sales, in both small and large Companies, Lancia is well Suited to Service eASIC Structured ASIC Customers

Santa Clara, California, April 3, 2007 – eASIC Corporation, a provider of Structured ASIC devices announced today the appointment of Fred N. Lancia II as Vice President of Sales. Reporting to Ronnie Vasishta, eASIC’s President and CEO, Lancia will oversee worldwide sales activities, establishing and executing an overall sales strategy to achieve the company’s aggressive growth plans. Drawing upon his extensive knowledge of the FPGA, ASIC and ASSP markets, Lancia will help eASIC accelerate customer adoption of its zero mask-charge structured ASICs. Lancia will connect eASIC’s disruptive product solution, the seasoned sales channel and the distribution resources for the benefit of the global customer base. His experience in working with large companies, as well as fast-growing small companies, provides Lancia an ideal background to manage eASIC’s sales, while promoting the company’s methodology of providing unparalleled customer service to ensure customer satisfaction. Read the rest of this entry »

H264-MCE core delivers an unprecedented 150MHz performance in eASIC Nextreme devices

Santa Clara, California, March 28, 2007 – eASIC Corporation, a provider of Structured ASIC devices today announced the immediate availability of the H264-MCE multi-channel baseline video encoder core from CAST, Inc. for implementation in eASIC Nextreme Structured ASIC devices. This solution is perfect fit for a wide range of video processing applications such as digital video-broadcasting and digital video surveillance equipment. Read the rest of this entry »

eASIC to Exhibit its Disruptive Structured ASIC Technology at the Worlds Largest Embedded Design Event

Santa Clara, California, March 27, 2007 – eASIC Corporation, a provider of Structured ASIC devices has been invited by Embedded Systems Design Magazine to present its unique Structured ASIC products in the Disruption Zone at the Embedded Systems Conference Silicon Valley (www.esconline.com/sv) held at the McEnery Convention Center in San Jose, California, April 1-5, 2007. The Disruption Zone was established to focus on dynamic companies who are instigating change and driving technology in new and innovative directions. This special area will showcase only a few select companies, each of whom will present its unique technology and products to a broad audience of engineers and engineering management developing processor-based systems. Read the rest of this entry »

Driven by customer demand, CriticalBlue’s Cascade now supports an expanded range of FPGA and Structured ASIC technologies, in addition to its traditional SoC target

San Jose, California – March 22, 2007 – CriticalBlue, a provider of tools for accelerating software in embedded microprocessor applications, has announced enhanced support to its Cascade coprocessor synthesis solution for FPGA and Structured ASIC silicon platforms. Based on CriticalBlue’s work with leading semiconductor and systems customers on deployment options for their embedded software, Cascade is now able to offer a flow that targets processor implementations in Xilinx VirtexTM and SpartanTM Platform FPGAs as well as eASIC’s NextremeTM Structured ASIC fabric. These new capabilities deliver additional choices to customers who are seeking the most appropriate silicon deployment vehicle for their embedded software products. Read the rest of this entry »

GenCore can now deliver to the Korean designers affordable ASICs with no mask charges and with an FPGA-like ease-of-design in a short time-to-market

Santa Clara, California, March 6, 2007 – eASIC Corporation, a provider of Structured ASIC devices today announced that it has entered into partnership agreement with GenCore, a Korea-based semiconductor solutions and ASIC services provider. This partnership grants GenCore the ability to provide sales support and design services for 90nm eASIC Nextreme Structured ASIC devices locally. This marks the sixth partnership agreement formed in Asia to extend eASIC’s global presence and answer the ever growing local need for an alternative ASIC solution. Read the rest of this entry »

The cooperation will allow the channel partners to answer their customer’s needs for a low-cost and low-power configurable logic alternative

Santa Clara, California, February 13, 2007 – eASIC Corporation, a provider of Structured ASIC devices and Configurable logic IP, today announced the addition of two new channel partners in Europe: Chipeo, based in France and Si-Bahn, based in Germany. Under the agreement, these European channel partners will provide the 90nm eASIC NextremeTM Structured ASIC devices, along with local design and sales support, to a growing community of configurable logic users. This expansion is part of eASIC’s value-based channel strategy focused on enhancing global presence and providing world-class support for its disruptive Structured ASIC products. Read the rest of this entry »

On-time and on-budget delivery of the 90nm eASIC Nextreme chips allows Cellular3G to demonstrate their leading-edge baseband technology at the 3GSM Show in Barcelona

3GSM, Barcelona , Spain and Santa Clara, California, February 12, 2007 – eASIC Corporation, a provider of Structured ASIC devices and Configurable Logic IP, and Cellular3G, a provider of high-end UMTS/3G baseband solutions, today announced the successful implementation of Cellular3G’s TopHat™ W-CDMA design in eASIC’s 90nm Nextreme Structured ASICs. Cellular3G has chosen eASIC’s Nextreme family due to its high performance and low power consumption features that could be achieved together with the advantages of no NRE, no minimum order quantity, and moreover, in a short turnaround time that was crucial for demonstrating their TopHat solution at the 2007 3GSM world-congress in Barcelona, Spain. Read the rest of this entry »

The eASIC Nextreme 90nm Structured ASIC delivered the fast turnaround, low-cost and low-power required for the SiP implementation

Santa Clara, California and Fukuoka, Japan, January 29, 2007 – eASIC Corporation, a provider of Structured ASIC devices and Configurable Logic IP, today announced that Fukuoka Intelligent Cluster Laboratory for Emerging and Enabling Technology of SoC (FLEETS), a technology research institute (Japan) selected eASIC’s Nextreme family of 90nm Structured ASIC devices for its unique System in Package (SiP) product. eASIC delivered to FLEETS on time the eASIC Nextreme product in both bare dice and packaged devices modes. FLEETS and eASIC have joined forces and combined their breakthrough technologies to enable rapid implementation of SiP system using a Structured ASIC fabric, delivering flexibility and affordability for mass usage. FLEETS choose eASIC’s Nextreme family due to its high performance, low power and ease-of-design features in addition to the advantages of no NRE and low unit cost. Read the rest of this entry »

MoreThanIP joins eASIC’s eZ-IP Alliance to expand IP portfolio for configurable fabric

Santa Clara, California and Karlsfled, Germany, January 26, 2007 – eASIC Corporation, a provider of Structured ASIC devices and Configurable logic IP, and MoreThanIP GmbH, a leading supplier of networking IP cores, today announced the immediate availability of a Tri-Mode (10/100/1000) Ethernet MAC core for eASIC’s 90nm Nextreme Structured ASIC Family. The dynamically configurable Tri-Mode Ethernet MAC core will enable engineers to build robust Ethernet line card, NIC card or switching applications operating at 10/100 or 1000Mbps (Gigabit Ethernet). Read the rest of this entry »

CAST joins eASIC’s newly established eZ-IP Alliance program

Santa Clara, California, January 11, 2007 – eASIC Corporation, a provider of Structured ASIC devices and Configurable Logic IP, today announced the availability of ARM AMBA Platform IP (PIP-AMBA) from CAST for eASIC’s 90nm Nextreme Structured ASIC product family. CAST, who joined the company’s newly established eZ-IP Alliance program, will partner with eASIC to provide customers with the essential IP cores and software infrastructure for eASIC’s soft ARM926EJ microprocessor core. Read the rest of this entry »

Santa Clara, California, January 4, 2007 – eASIC Corporation, a provider of Structured ASIC devices and Configurable Logic IP, today announced the immediate availability of an ARM926EJ processor, offered in eASIC’s Nextreme 90nm product family. Now, FPGA, ASIC and System-on-Chip designers can benefit from a low-cost, fast-turnaround design with no-minimum order quantity. Under the agreement signed between ARM [(LSE:ARM); (Nasdaq: ARMHY)] and eASIC, this partnership will enable a broad range of users to have access, for the first time, to a 32-bit CPU core on a configurable fabric, while meeting the power, price and performance requirements of their Structured ASIC or Platform Designs. Read the rest of this entry »