Tuesday, 7 December, 2010
New Value Shuttle™ Delivers 45nm NEW ASIC Prototypes for $45K
Santa Clara, CA – December 7, 2010 – eASIC Corporation, a provider of NEW ASIC devices, today introduced a Value Shuttle™ program that lowers the entry cost for 45nm ASIC designs. The 45nm Value Shuttle™ enables designers to receive forty-five (45) eASIC Nextreme-2 NEW ASIC prototypes for only forty-five thousand dollars ($45K), a small fraction of the cost of competing ASIC solutions. Through reducing the cost, and hence development risk of ASIC design prototypes, the 45nm eASIC Value Shuttle™ enables designers to bring forward the transition point where designs switch from FPGA to ASIC. Read the rest of this entry »
Tuesday, 9 November, 2010
Power Consumption of CPRI-based Designs Reduced by up to 80%, With exceptionally High Signal Integrity Compared to FPGA Implementations
Santa Clara, CA, November 9, 2010 — eASIC Corporation, a supplier of NEW ASICs and Radiocomp, a leading provider of modular RF systems and components for mobile and wireless infrastructure networks, today announced the immediate availability of a low power Common Public Radio Interface (CPRI) v4.1 solution for Radio Equipment Controller (REC) equipment. Using the low power transceivers on eASIC Nextreme-2T NEW ASICs, and the industry proven CPRI v4.1 REC IP core from Radiocomp, the solution consumes only 190 mW per channel at 6.144 Gbps. Read the rest of this entry »
Tuesday, 5 October, 2010
eASIC Nextreme NEW ASICs Accelerate Adoption of Wireless Solutions for Smart Grid, Remote Sensing and Location Tracking Systems
SANTA CLARA, CA, – October 5, 2010 – eASIC Corporation, a provider of NEW ASIC devices, today announced that On-Ramp Wireless, Inc., a provider of low-power, wide area scalable wireless networking systems successfully rolled out its eNode Wireless modules six months ahead of schedule. Its fast-turnaround was facilitated by eASIC’s Nextreme NEW ASICs, which is a part of the eNODE baseband processing engine. eNODE wireless modules are used in wide area, low power and low data rate applications such as sensor monitoring, utility distribution automation, smart metering, and location tracking, to name some examples. Read the rest of this entry »
Tuesday, 15 June, 2010
Seasoned Semiconductor Industry Executive Joins eASIC to Manage the Company Operations Ramp Through the Next Phase of Growth Acceleration
Santa Clara, CA – June 15, 2010 – eASIC Corporation, a provider of NEW ASIC devices, today announced that Richard Heye has been appointed as Chief Operating Officer (COO). Heye brings 30 years of executive management, engineering and operations experience from within the semiconductor industry. Heye is chartered with spearheading eASIC’s engineering development of, as well as, growing operations to meet the rapid customer ramp. Heye will report directly to CEO, Ronnie Vasishta. Read the rest of this entry »
Thursday, 13 May, 2010
Companies Work Together to Accelerate Market Adoption of Desktop Virtualization
Santa Clara, CA – May 13, 2010 – eASIC Corporation today announced that it is working with Microsoft Corp. on using eASIC’s Nextreme NEW ASICs to create a hardware implementation of the Microsoft RemoteFXTM technology, which was announced two months ago. eASIC’s Nextreme product has been able to quickly validate the Microsoft RemoteFX technology in silicon and to attract a growing ecosystem of companies interested in developing eASIC-based solutions that accelerate the adoption of remote and shared resource computing applications. Read the rest of this entry »
Wednesday, 5 May, 2010
New eTools 8.1 Enables Designers to Achieve up to 30% Higher Performance in 40% Less Time
Santa Clara, CA – May 5, 2010 – eASIC Corporation, a provider of NEW ASIC devices, today announced the immediate availability of its eTools 8.1 Design Suite for implementing 45nm eASIC Nextreme-2 designs. The eTools 8.1 tool suite delivers a robust ASIC grade design flow with the simplicity and ease of design that is normally associated with FPGA design tools. New features and enhancements in eTools 8.1 enable designers to reduce overall design time by up to 40% while increasing design performance by up to 30% compared to the previous eTools 8.0 suite. Read the rest of this entry »
Wednesday, 3 March, 2010
New LEON4 core delivers 50% Performance Increase
Santa Clara, CA – March 03, 2010 – eASIC Corporation, a supplier of NEW ASICs, today announced the immediate availability of Aeroflex Gaisler’s next generation LEON processor, the LEON4, as part of its eZ-IP Alliance Core Library. LEON4 is a high performance, 32-bit processor core based on the SPARC V8 architecture. The new LEON4 core complements the widely used LEON3 processor for high-performance embedded applications across a broad spectrum of demanding consumer and industrial applications. Read the rest of this entry »
Thursday, 21 January, 2010
New Devices Reduce Power Consumption up to 40%
Santa Clara, CA – January 21, 2010 - eASIC Corporation, today announced the immediate availability of two new lower power device options for its eASIC Nextreme Family. The NX750LP and NX750 eASIC Nextreme devices are now available with operating voltage down to 1.0V thereby enabling designers to achieve up to 40% lower power consumption. The new 1.0V device options are optimized for applications that require low cost and low power such as smart meters, portable projectors, toys, and handheld medical devices. Read the rest of this entry »
