Santa Clara, CA – May 2nd, 2012 – eASIC Corporation, a provider of NEW ASIC devices, today announced that Tokyo Institute of Technology, in collaboration with Hitotsubashi University, has successfully demonstrated a 3X increase in energy efficiency for a green supercomputer used for performing astronomical simulations. By leveraging eASIC´s low power Nextreme-2 NEW ASIC devices, Tokyo Institute of Technology was able to achieve an energy efficiency ratio of 6.5 GFLOPS/Watt for its GRAPE-8 supercomputer. Read the rest of this entry »

Santa Clara, CA – February 27, 2012 – eASIC Corporation, a provider of NEW ASIC devices, today announced that it has shipped in excess of three million chips and achieving this shipment milestone firmly solidifies eASIC’s position as a high volume supplier of custom integrated circuits. eASIC expects to be at more than double that number of shipments by the end of 2012. Read the rest of this entry »

Santa Clara, CA – January 30, 2012 – eASIC Corporation, a provider of NEW ASIC devices, today announced 80% growth in sales revenue from calendar year 2010 to 2011. The majority of the revenue in 2011 was split between wireless infrastructure and storage markets. However, other applications also contributed to the revenue. At the end of 2011 eASIC had completed 170 tape-outs and had delivered 167 prototypes. In addition, 66% of the revenue was derived from shipping new products, namely, 45nm Nextreme-2 NEW ASIC production. Read the rest of this entry »