June 15th, 2010
Seasoned Semiconductor Industry Executive Joins eASIC to Manage the Company Operations Ramp Through the Next Phase of Growth Acceleration
Santa Clara, CA – June 15, 2010 – eASIC Corporation, a provider of NEW ASIC devices, today announced that Richard Heye has been appointed as Chief Operating Officer (COO). Heye brings 30 years of executive management, engineering and operations experience from within the semiconductor industry. Heye is chartered with spearheading eASIC’s engineering development of, as well as, growing operations to meet the rapid customer ramp. Heye will report directly to CEO, Ronnie Vasishta. Read the rest of this entry »
May 13th, 2010
Companies Work Together to Accelerate Market Adoption of Desktop Virtualization
Santa Clara, CA – May 13, 2010 – eASIC Corporation today announced that it is working with Microsoft Corp. on using eASIC’s Nextreme NEW ASICs to create a hardware implementation of the Microsoft RemoteFXTM technology, which was announced two months ago. eASIC’s Nextreme product has been able to quickly validate the Microsoft RemoteFX technology in silicon and to attract a growing ecosystem of companies interested in developing eASIC-based solutions that accelerate the adoption of remote and shared resource computing applications. Read the rest of this entry »
May 5th, 2010
New eTools 8.1 Enables Designers to Achieve up to 30% Higher Performance in 40% Less Time
Santa Clara, CA – May 5, 2010 – eASIC Corporation, a provider of NEW ASIC devices, today announced the immediate availability of its eTools 8.1 Design Suite for implementing 45nm Nextreme-2 designs. The eTools 8.1 tool suite delivers a robust ASIC grade design flow with the simplicity and ease of design that is normally associated with FPGA design tools. New features and enhancements in eTools 8.1 enable designers to reduce overall design time by up to 40% while increasing design performance by up to 30% compared to the previous eTools 8.0 suite. Read the rest of this entry »
March 3rd, 2010
New LEON4 core delivers 50% Performance Increase
Santa Clara, CA – March 03, 2010 – eASIC Corporation, a supplier of NEW ASICs, today announced the immediate availability of Aeroflex Gaisler’s next generation LEON processor, the LEON4, as part of its eZ-IP Alliance Core Library. LEON4 is a high performance, 32-bit processor core based on the SPARC V8 architecture. The new LEON4 core complements the widely used LEON3 processor for high-performance embedded applications across a broad spectrum of demanding consumer and industrial applications. Read the rest of this entry »
January 21st, 2010
New Devices Reduce Power Consumption up to 40%
Santa Clara, CA – January 21, 2010 - eASIC Corporation, today announced the immediate availability of two new lower power device options for its eASIC Nextreme Family. The NX750LP and NX750 Nextreme devices are now available with operating voltage down to 1.0V thereby enabling designers to achieve up to 40% lower power consumption. The new 1.0V device options are optimized for applications that require low cost and low power such as smart meters, portable projectors, toys, and handheld medical devices. Read the rest of this entry »
