Cellular3G Uses eASIC’s Nextreme Structured ASICs For Its TopHat W-CDMA (3GPP) Baseband Solution
February 12, 2007
On-time and on-budget delivery of the 90nm eASIC Nextreme chips allows Cellular3G to demonstrate their leading-edge baseband technology at the 3GSM Show in Barcelona
3GSM, Barcelona , Spain and Santa Clara, California, February 12, 2007 – eASIC Corporation, a provider of Structured ASIC devices and Configurable Logic IP, and Cellular3G, a provider of high-end UMTS/3G baseband solutions, today announced the successful implementation of Cellular3G’s TopHat™ W-CDMA design in eASIC’s 90nm Nextreme Structured ASICs. Cellular3G has chosen eASIC’s Nextreme family due to its high performance and low power consumption features that could be achieved together with the advantages of no NRE, no minimum order quantity, and moreover, in a short turnaround time that was crucial for demonstrating their TopHat solution at the 2007 3GSM world-congress in Barcelona, Spain.
“eASIC’s Nextreme is an ideal solution for meeting the combination of challenges that consumer electronic developers face today – price, functionality and flexibility – all under the time-to-market constant pressures”, said Menachem Kenan, CEO of Celluar3G. “When we searched for a fast implementation way of our W-CDMA baseband design in silicon, eASIC offered us the perfect solution that could allow for a quick yet very affordable chip set, without NRE cost or any upfront charges. Our goal was to get the chips before the 3GSM conference in order to have a live demonstration of our TopHat product in front of wireless designers. With the commitment of eASIC’s team and the dedicated customer support, we were able to achieve that.”
“Our goal is to help our customers execute their innovative ideas by implementing their designs in our breakthrough Structured ASIC silicon: innovation drives innovations”, said Ronnie Vasishta eASIC CEO. “The W-CDMA baseband technology from Cellular3G allows quick integration into user equipment, better reception, and faster data transfer rates. Using our eASIC Nextreme product, Celluar3G is able to pass on these benefits to their customers and achieve their objectives. eASIC is strategically positioned to provide an alternative when FPGAs or Standard Cell ASICs would have required too high an investment, too long turnaround time and the risk would have been too large.”
Cellular3G, Inc. is a fabless semiconductor company focusing on the development and marketing of high end 3G UMTS HSDPA/HSUPA baseband chips for use in mobiles, Smart Phones, and cameras. The company has developed UMTS baseband solutions which provide the users with low power consumption by utilizing optimum hardware and software techniques. Cellular3G’s technology enables mobile units to maximize battery life while enabling very high speed data. Sold to customers as a chip or as a licensed IP package, Cellular3G has found a world-wide market. Cellular3G was founded in 1999 with investment from Carphone Warehouse. www.Cellular3G.com
eASIC is a fabless semiconductor company offering breakthrough Structured ASIC devices aimed at dramatically reducing the overall fabrication cost and time of customized semiconductor chips. Low-cost, high-performance and fast-turn ASIC and System-on-Chip designs are enabled through patented technology of FPGA-like programmable logic coupled with ASIC-like Via-layer customizable routing. This innovative fabric efficiently employs mask-less customization with Direct-write e-Beam, and thus allows eASIC to offer zero mask-charge Structured ASICs.
Founded in 1999, eASIC Corporation is privately held, headquartered in Santa Clara, California. Investors include Vinod Khosla, Kleiner Perkins Caufield and Byers (KPCB), Crescendo Ventures, and Evergreen Partners www.eASIC.com