Ronnie Vasishta

President and Chief Executive Officer

Ronnie Vasishta has over 25 years of extensive experience in marketing, manufacturing, design and operational management in the semiconductor field. Prior to joining eASIC, Ronnie was Vice President of Technology Marketing at LSI Logic, where he served in various engineering, technical and strategic marketing management positions. Ronnie drove the strategic direction of the ASIC product line, and his areas of responsibilities included all aspects of the ASIC and custom logic products, EDA, design methodology, IP (serving on the board of the VSIA), silicon process technology, manufacturing and strategic partnerships. Prior to LSI Logic, Ronnie held process and test engineering positions at Motorola Incorporated and STC Semiconductor.

Ronnie has BSc (Hons) in Electrical and Electronic Engineering from Trent University, Nottingham, UK.

Dr. Ranko Scepanovic

Chief Technology Officer and Senior Vice President of Engineering

Dr. Ranko Scepanovic is responsible for defining eASIC’s technology vision and strategy and delivering to that strategy with state-of-the-art hardware and software products. He is also responsible for growing eASIC’s technical patent portfolio.

Dr. Scepanovic joined eASIC as Senior Vice President, Software and Advanced Technology in May 2008 when he brought over 23 years of research and industry experience, gained through a number of technical and leadership positions. Before joining eASIC, Dr. Scepanovic was Vice President and Fellow of the Advanced Development Group at LSI Corporation . At LSI, Dr. Scepanovic received many awards including the CEO Award for Excellence and Inventor of the Year. Dr. Scepanovic holds over 137 Patents in fields such as EDA algorithms and tools and IC/System technologies.

Dr. Scepanovic holds a Ph.D in Mathematical Sciences from the University of Belgrade, former Yugoslavia.

Brian McDonald

Chief Financial Officer and Vice President of Finance

Brian McDonald has over 30 years of finance experience with high technology companies. Prior to joining eASIC Brian was Chief Financial Officer, Sr. VP of Finance and Secretary at Advanced Analogic Technologies (AATI) a public silicon valley company. Brian was instrumental in taking AATI successfully through the IPO process in 2005. Prior to AATI Brian has held senior financial positions at Monolithic Power Systems, Elantec Semiconductor, National Semiconductor, Mattson Technology, Micro Linear, and Read-Rite corporation. Brian holds a BS degree in Business Administration from Santa Clara University.

 

 

Seiji Miwa

President of eASIC Japan

Seiji Miwa has over 40 years of experience in the electronics industry. During this period he has developed strong relationships with the top management of leading Japanese semiconductor companies. Before joining eASIC, he served as President of AmmoCore Japan. Previously, he was chairman and President of Magma Design Automation, K.K. Japan. And prior to Magma, Miwa-san served as President and then Chairman at Cadence Design Systems, K.K. Japan. Miwa-san moved his career to chip design and test when he joined the Japanese subsidiary of Teradyne as a Vice President. Earlier in his career, Miwa-san held several management positions at Topre Corp, including Board member, Executive VP of R&D, General Manager of New Business Units including Automotive.

Miwa-san received a degree in Economic and Business Management from the University of Kyushu and Business Consulting certificate from the Industrial Productivity Institute.

Jasbinder Bhoot

Vice President, Worldwide Marketing

Jasbinder Bhoot (Jazz) has more than 20 years of ASIC and FPGA experience and is responsible for setting the marketing strategy for the company with overall responsibility for product definition and deployment. Prior to joining eASIC, Jazz was part of the vertical marketing team at Xilinx. In this role, he managed the partner solutions team that included IP, design services, EDA, and ASSP vendors.

Jazz has also held technical and business management positions at LSI Logic, Altera, Sony Semiconductor, and Texas Instruments.

Jazz holds a B.S. in Electronic Engineering from the University of Westminster and an M.B.A. from the University of Nottingham.

Massimo Verita

Vice President, Customer Engineering

Massimo Verita has over 20 years of experience in the IC and Semiconductors industry, where he assumed a variety of roles in Engineering, Customer Engineering and General Management of business units in the Wireless and Consumer markets. Prior to joining eASIC, Massimo was Vice President and General Manager, Consumer Custom Solutions at LSI Logic, where he had responsibility for high volume ASIC designs in the Consumer market. Previously he held various senior management positions at LSI Logic, including the Processor Cores unit, which drove Intellectual Property licensing and strategy for the company. He started his career as Applications Engineer at AT&T Microelectronics (today part of LSI).

Massimo holds a degree in Electrical Engineering (MsEE) from the University of Trieste, Italy

Mike Basanty

Vice President of Operations

Mike Basanty brings to eASIC over 29 years of hands-on technology and management experience in semiconductor IC development and manufacturing. Mike has direct experience in building new organizations and setting up operations from the ground up, as well as managing large scale mature product lines. His expertise spans new product development, product and test engineering, quality and reliability, supply chain management, cost reduction, and customer service. Mike’s previous experience, in roles of increasing responsibility leading up to Vice President of Operations, includes work at large integrated device manufacturers Cypress, LSI Logic, IDT, and Intel, and emerging fabless semiconductor companies Optichron (acquired by NetLogic), Velogix, Azanda (Acquired by Cortina systems), Cirrus Logic, and Trident Microsystems. Mike holds a BSEE from U.C. Berkeley, and MSEE and MBA degrees from Santa Clara University.