eASIC nextreme




Huawei Selects eASIC for Transport Network Backhaul

Huawei Selects eASIC for Transport Network Backhaul

October 26, 2014



Santa Clara, CA – October 27, 2014 – eASIC Corporation, a leading provider of Single Mask Adaptable ASIC devices, today announced that Huawei is using eASIC’s Nextreme-3 28 nm devices to meet the increased system performance and aggressive costs required by Transport Network Products. Due to the increased throughput, Transport Networks require twice the clock performance of traditional communications.

Huawei investigated multiple options to meet the demanding performance, power and total cost of ownership targets set by the global operators, eASIC’s 28 nm Single Mask Adaptable devices enabled Huawei to meet all the operator requirements.

“eASIC Nextreme-3 28 nm device can provide higher performance, lower power to meet Huawei product requirements”, said Ronnie Vasishta, president and CEO of eASIC Corporation. “Expansion to the higher throughput in transport network is inevitable and this requires innovative solutions that can only be addressed with custom silicon. We are excited to be shipping products to Huawei and to help them meet their aggressive performance, power and cost objectives, as FPGAs can no longer meet these critical requirements.”

About Huawei

Huawei is a leading global information and communications technology (ICT) solutions provider. Through its dedication to customer-centric innovation and strong partnerships, Huawei has established end-to-end advantages in telecom networks, devices and cloud computing. Huawei is committed to creating maximum value for telecom operators, enterprises and consumers by providing competitive solutions and services. Its products and solutions have been deployed in over 170 countries, serving more than one third of the world’s population.

For more information on Huaweiplease visit www.huawei.com.

About eASIC

eASIC is a fabless semiconductor company offering breakthrough Single Mask Adaptable ASIC devices aimed at dramatically reducing the overall cost and time-to-production of customized semiconductor devices. Low-cost, high-performance and fast-turn ASIC and System-on-Chip designs are enabled through patented technology utilizing Via-layer customizable routing. This innovative fabric allows eASIC to offer a new generation of ASICs with significantly lower up-front costs than traditional ASICs.

Privately held eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Kleiner Perkins Caufield and Byers (KPCB), Crescendo Ventures, Seagate Technology and Evergreen Partners. For more information on eASIC please visit www.easic.com.

Press Contact

eASIC Corporation
Brent Przybus
(408) 855-9200
bprzybus@easic.com