eASIC nextreme




Mobiveil Joins eASIC eZ-IP Alliance Program

Mobiveil Joins eASIC eZ-IP Alliance Program

June 16, 2014



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Santa Clara, CA – June 16, 2014 – eASIC Corporation, a leading provider of Single Mask Adaptable ASIC™ devices and Mobiveil, Inc. a fast growing supplier of silicon intellectual property (SIP), and IP-enabled design services, today announced that Mobiveil has joined eASIC’s eZ-IP alliance program. With this partnership, Mobiveil’s portfolio of silicon-proven high speed serial interface and parallel memory interface IPs will be made available for eASIC devices.

“We are pleased to have Mobiveil join the eASIC eZ-IP program”, said Jasbinder Bhoot, vice president of worldwide marketing at eASIC. “We are seeing increasing demand for silicon-proven IP across our fastest growing applications, including enterprise storage, wireless infrastructure, and high performance computing. The combination of our 28nm eASIC Nextreme-3 family coupled with Mobiveil’s silicon proven IPs will allow us to deliver high performance, low cost and fast-time to market ASIC devices.”

“eASICs approach to reducing the overall cost of silicon customization is powerful and unique and, as a result, we are delighted to join the eZ-IP alliance program. With our SIP offerings we look forward to quickly enable many solutions in the storage, wireless, and datacenter applications on the eASIC platform.” said Ravi Thummarukudy, CEO of Mobiveil, Inc.

About Mobiveil, Inc.

Mobiveil is a fast‐growing technology company that specializes in development of Silicon Intellectual Properties (SIPs), platforms and solutions for the networking, storage and enterprise markets. Mobiveil team leverages decades of experience in delivering high‐quality, production‐proven, high-speed serial interconnect Silicon IP cores along with custom and standard form factor hardware boards to leading customers worldwide. Mobiveil is headquartered in the Silicon Valley with engineering development centers located in Milpitas, CA, Chennai and Bangalore, India, and sales offices and representatives located in US, Europe, Israel, Japan, Taiwan and Peoples Republic of China. For more information, please visit www.mobiveil.com.

About eASIC

eASIC is a fabless semiconductor company offering breakthrough Single Mask Adaptable ASIC devices aimed at dramatically reducing the overall cost and time-to-production of customized semiconductor devices. Low-cost, high-performance and fast-turn ASIC and System-on-Chip designs are enabled through patented technology utilizing Via-layer customizable routing. This innovative fabric allows eASIC to offer a new generation of ASICs with significantly lower up-front costs than traditional ASICs.

Privately held eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Kleiner Perkins Caufield and Byers (KPCB), Crescendo Ventures, Seagate Technology and Evergreen Partners. For more information on eASIC please visit www.easic.com.