eASIC nextreme




Testimonials



Huawei

Huawei investigated multiple options to meet the demanding performance, power and total cost of ownership targets set by the global operators, eASIC’s 28 nm Single Mask Adaptable devices enabled Huawei to meet all the operator requirements.

Huawei
Mr. Atsushi Noro, Deputy General Manager, Mobile Wireless Solutions Division. NEC

Our customers, the global operators, are constantly needing a reduction in their total cost of ownership, an increased performance envelope and a fast time to deployment of their microwave backhaul solutions. ASIC devices are exactly the technology to enable us to meet these operator requirements. As microwave units are getting smaller, NEC is able to reduce total cost of ownership for the operators through the significant power advantages of the eASIC devices.

Mr. Atsushi Noro, Deputy General Manager, Mobile Wireless Solutions Division. NEC
Kevin Rowett, vice president of Engineering, Violin Memory Inc.

We looked at a number of ASIC platform choices for implementing our custom FLASH controllers. We opted to collaborate with eASIC for reducing cost and power consumption because their Nextreme-2T NEW ASICs enabled us to quickly migrate from FPGAs, and inexpensively ramp our solutions to high volume production.

Kevin Rowett, vice president of Engineering, Violin Memory Inc.
Kurt Richarz, Seagate Executive Vice President of Sales

Seagate is delighted to have launched Momentus®XT, the industry’s first solid state hybrid drive, using the easicopy ASIC Migration product. We were able to use Nextreme NEW ASICs to accelerate time-to-market of Momentus®XT. eASIC seamlessly migrated our design to easicopy™. We see easicopy™ as a natural extension to our value engineering programs as we take products from initial ramp through to very high volumes.

Kurt Richarz, Seagate Executive Vice President of Sales
Mr. Dai Vu, Director of Virtualization Solutions Marketing, Microsoft Corp.

By working with eASIC’s Nextreme NEW ASIC, we were able to develop a reference design for RemoteFX hardware solutions that is low in power consumption as well as low in up-front development cost. “We see eASIC’s Nextreme as a platform well suited for our efforts to quickly validate new technologies, but also as a catalyst in enabling our RemoteFX partner ecosystem to ramp up their solutions to market readiness.

Mr. Dai Vu, Director of Virtualization Solutions Marketing, Microsoft Corp.
Sunny Ng, Aurora Systems

eASIC’s Nextreme devices offered us the only solution to meet the stringent cost, performance and power requirements for our consumer digital video products. We were extremely impressed with the fast turnaround time and low up front cost. I am not surprised that eASIC has rapidly reached this impressive milestone. We are privileged to be the recipient of the 100th Design Win award.

Sunny Ng, Aurora Systems

Using eASIC Nextreme devices together with our SiP technologies, we were able to significantly speed up the product development cycle, achieving our target performance and moreover, saving the NRE cost. These benefits allowed us to get to market with a functioning board, on schedule and on budget.

Masato Tsuru, FLEETS

eASIC has enabled us to very quickly develop a low-cost video processing ASIC for our product designed for the Chinese portable consumer device market. We just could not have achieved this with any low-cost FPGA, period.

Mike Aronson, Rumble Development
Douglas (Doug-Myoung) Lee, NexusChips

With eASIC’s Nextreme, we were able to achieve 2X higher performance at 1/5th the power of our Xilinx Virtex-4 FPGA. This was crucial for securing our design win for our graphics acceleration system

Douglas (Doug-Myoung) Lee, NexusChips
Kevin Chiang, AVTECH

In addition to the substantial system cost saving, we were pleasantly surprised at how quick we received working devices and how much lower the power consumption was compared to the low density FPGA we were using. eASIC’s zero-mask charge, fast turnaround ASICs helped us to make quick changes to keep up with the latest requirements from our customers and also rapidly ramp into high volume production.

Kevin Chiang, AVTECH
Akira Itoh, Fujitsu Advanced Technologies Ltd

Fujitsu Advanced Technologies Ltd is pleased to see that eASIC is delivering a 45nm product. This New ASIC is able to deliver the right combination of performance, power and price combined with low up-front cost. We find the power reduction especially important as we look to add more functionality to our world-class ICT infrastructure products.

Akira Itoh, Fujitsu Advanced Technologies Ltd
Pierre Boulanger, FLIR Systems, CVS Division

We successfully ported an existing production FPGA design to eASIC’s Nextreme, validating the power savings, tools suite effectiveness, cost, scheduling and support. All were validated with flying colors, making us eager to proceed to the next phase.

Pierre Boulanger, FLIR Systems, CVS Division
John Goodacre, ARM Processor Division

We were able to develop our eASIC device in a reduced time and cost of a standard cell ASIC and with development costs that were even lower than an FPGA approach and the eASIC device worked right first time on our PBX-A9 validation and development board. We see the 90nm eASIC Nextreme  technology as a very cost effective way of validating and demonstrating new products to our customer base and getting them to market much earlier.

John Goodacre, ARM Processor Division
Mr. Shigenori Shibue, Mitsubishi Electric Corporation, Kyoto Works

We are excited to have a path to developing ASIC solutions quickly that are low in up-front development cost, quick to develop and gets us to market in rapid time to fully exploit our market opportunities. “We see eASIC’s Nextreme as a platform that we can use to create new high performance product derivatives quickly to respond to changing market needs, yet still be very competitive in volume production”.

Mr. Shigenori Shibue, Mitsubishi Electric Corporation, Kyoto Works