Optimize your custom eASIC solution for power, performance and fast time-to-deployment. Obtain ASIC level performance whether your application is logic, DSP or IO dominated. Achieve up to 80% lower power consumption than equivalent FPGA implementations. Save months of development time and multiple millions of dollars versus traditional ASICs with eASIC’s unique single mask layer customization.
Meet the Family
eASIC Nextreme-2 is manufactured on a 45 nm process and offers up to 5.9 millions equivalent logic gates, 16.8 Mb of bRAM at 500 MHz and 32 high-speed transceivers at 6.5 Gbps.
eASIC Nextreme-3 is built on a 28 nm process and provides up to 18 million equivalent logic gates, 56 Mb of bRAM and
52 high-speed transceivers
at 12.5 Gbps.
eASIC Nextreme-3S provides up to 52 million equivalent ASIC gates with 124 Mb of true dual port memory with
28 Gbps and 16.3 Gbps
high speed transceivers.
easicopy provides a seamless and low risk migration path from eASIC Nextreme-2,
or eASIC Nextreme-3S to a lower unit cost cell based ASIC.
eASIC Nextreme devices provide up to 80% lower power consumption than equivalent SRAM FPGAs.
We know that time equals money, with eASIC you can deliver products up to 6 months earlier than a traditional ASIC.
eASIC Nextreme devices can meet the most demanding performance applications whether they are logic, DSP, data plane or control plane applications.
Low Manufacturing Cost
eASIC devices only require one unique mask for customization. This equates in to significantly lower development and manufacturing cost. The savings versus traditional ASICs can be in the multiple millions of dollars.
Low Unit Cost
eASIC devices only use the silicon area that you really need for your design, not more. Our customers have saved in excess of $100’s million versus expensive FPGAs.
We well know that customers may change their mind adding the new feature last minute. eASIC’s fast turnaround time enables you to plan for multiple chip revision at a fraction of the cost and time of an ASIC, meeting or exceeding your customers’ needs.
eASIC Engages Si-Edge to Provide Additional Advanced Design Center Support in China for eASIC’s Custom IC Platform »
eASIC reacts to increased demand in China for its configurable custom IC’s in applications such as artificial intelligence, virtual reality, data center acceleration, data center storage and next generation communications. Santa Clara, CA – September 6, 2017 – eASIC® Corporation (@easic), a fabless semiconductor company that delivers custom integrated circuit platform solutions (eASIC Platform), today […]
eASIC Participates at the Deterministic Ethernet Forum, Vienna, Austria (April 27-28, 2017)