eASIC nextreme




103 Search Results for: nextreme

eASIC Nextreme-3S

eASIC Nextreme-3S

eASIC Nextreme-3S™ is eASIC’s fifth generation eASIC Platform and is built on a 28nm CMOS process. eASIC Nextreme-3S provides designers with an ideal solution when low power, high performance, time to market and total cost of ownership are paramount. The eASIC Nextreme-3S family has an optimized architecture that is ideal for either logic, DSP or […]



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Aug 11, 2015

eASIC Announces Nextreme-3 Platform Support for PCIe Gen 3.1 – SRIS

Nextreme-3 enables scalable, high bandwidth, cabled connectivity with SATA-Express using PCIe Gen 3.1 SANTA CLARA, Calif. – August 11, 2015 – eASIC® Corporation (@easic), a fabless semiconductor company that delivers a custom integrated circuit (IC) platform (eASIC Platform) today announced immediate availability of silicon-proven transceivers optimized for the PCIe 3.1 electrical specification. The eASIC Nextreme-3 […]



eASIC Nextreme-2

eASIC Nextreme-2

eASIC Nextreme-2™ is eASIC’s third generation eASIC Platform, manufactured on a 45nm CMOS process, and built using eASIC’s patented single-via customization technology. The eASIC Nextreme-2 family contains two variants optimized to meet different application needs – eASIC Nextreme-2 and eASIC Nextreme-2T that comes with serial MGIO transceivers. eASIC Nextreme-2 and eASIC Nextreme-2T™ devices provides ASIC-like […]



eASIC Nextreme-3

eASIC Nextreme-3

eASIC Nextreme-3™ is eASIC’s fourth generation eASIC Platform manufactured on a 28 nm CMOS process. The eASIC Nextreme-3 family provides ASIC-like performance, power and low unit-cost combined with FPGA-like design flow and rapid delivery of prototype devices. eASIC Nextreme-3 Platforms come with an enhanced architecture that offers twice the performance and half of the power […]



eASIC and EnSilica Announce 16-bit and 32-bit Soft Processors for eASIC Nextreme Devices

Jan 13, 2014

eASIC and EnSilica Announce 16-bit and 32-bit Soft Processors for eASIC Nextreme Devices

Santa Clara, CA – January 13, 2014 – eASIC® Corporation, a leading provider of Single Mask Adaptable ASIC™ and EnSilica, a leading independent provider of IC design services and IP today announced the immediate availability of 16-bit (eSi-1600) and 32-bit (eSi-3200) soft processor cores. The eSi-1600 and the eSi-3200 are based on an EnSilica’s eSi-RISC […]



eASIC Nextreme Used for Hardware Validation of Microsoft RemoteFX Technology

May 13, 2010

eASIC Nextreme Used for Hardware Validation of Microsoft RemoteFX Technology

Companies Work Together to Accelerate Market Adoption of Desktop Virtualization Santa Clara, CA – May 13, 2010 – eASIC Corporation today announced that it is working with Microsoft Corp. on using eASIC’s Nextreme NEW ASICs to create a hardware implementation of the Microsoft RemoteFXTM technology, which was announced two months ago. eASIC’s Nextreme product has […]



eASIC and IPextreme Announce Freescale Coldfire Processors for Nextreme NEW ASICs

Jun 14, 2009

eASIC and IPextreme Announce Freescale Coldfire Processors for Nextreme NEW ASICs

Companies Collaborate to Deliver Small Foot-print, low-cost, ColdFire Implementations Santa Clara, CA – June 15, 2009 – eASIC Corporation, a provider of NEW ASICs devices, and IPextreme®, the company bringing famous IP (intellectual property) to system-on-chip designers worldwide, today announced the immediate availability of Freescale´s 32-bit V1 and V2 ColdFire processor cores for eASIC Nextreme […]



eASIC Partners with Premier Technical Sales to Enhance its Customer sales and support for Nextreme Structured ASIC in North America

May 14, 2007

eASIC Partners with Premier Technical Sales to Enhance its Customer sales and support for Nextreme Structured ASIC in North America

Premier will Leverage its Experience and Strong Customer base to Broaden the Reach of eASIC’s Innovative yet Affordable Custom Logic Products Santa Clara, California, May 14, 2007 – eASIC Corporation, a provider of Structured ASIC devices, today announced that it has entered into partnership agreement with Premier Technical Sales, a leading high-tech manufacturers’ representative of […]



CAST’s High Performance H.264 Encoder Available Now In eASIC’s Zero Mask-charge Nextreme Structured ASICs

Mar 28, 2007

CAST’s High Performance H.264 Encoder Available Now In eASIC’s Zero Mask-charge Nextreme Structured ASICs

H264-MCE core delivers an unprecedented 150MHz performance in eASIC Nextreme devices Santa Clara, California, March 28, 2007 – eASIC Corporation, a provider of Structured ASIC devices today announced the immediate availability of the H264-MCE multi-channel baseline video encoder core from CAST, Inc. for implementation in eASIC Nextreme Structured ASIC devices. This solution is perfect fit […]



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Mar 6, 2007

eASIC and GenCore form partnership for distribution of Nextreme structured ASIC devices in Korea

GenCore can now deliver to the Korean designers affordable ASICs with no mask charges and with an FPGA-like ease-of-design in a short time-to-market Santa Clara, California, March 6, 2007 – eASIC Corporation, a provider of Structured ASIC devices today announced that it has entered into partnership agreement with GenCore, a Korea-based semiconductor solutions and ASIC […]



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Feb 12, 2007

Cellular3G Uses eASIC’s Nextreme Structured ASICs For Its TopHat W-CDMA (3GPP) Baseband Solution

On-time and on-budget delivery of the 90nm eASIC Nextreme chips allows Cellular3G to demonstrate their leading-edge baseband technology at the 3GSM Show in Barcelona 3GSM, Barcelona , Spain and Santa Clara, California, February 12, 2007 – eASIC Corporation, a provider of Structured ASIC devices and Configurable Logic IP, and Cellular3G, a provider of high-end UMTS/3G […]



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Jan 29, 2007

Fukuoka Intelligent Cluster Laboratory Chooses eASIC’s Nextreme Devices for its Unique System-in-package (SiP) Development

The eASIC Nextreme 90nm Structured ASIC delivered the fast turnaround, low-cost and low-power required for the SiP implementation Santa Clara, California and Fukuoka, Japan, January 29, 2007 – eASIC Corporation, a provider of Structured ASIC devices and Configurable Logic IP, today announced that Fukuoka Intelligent Cluster Laboratory for Emerging and Enabling Technology of SoC (FLEETS), […]



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Jan 26, 2007

eASIC and MoreThanIP Partner to Deliver Tri-Mode (10/100/1000) Ethernet MAC Solutions for Nextreme Structured ASICs

MoreThanIP joins eASIC’s eZ-IP Alliance to expand IP portfolio for configurable fabric Santa Clara, California and Karlsfled, Germany, January 26, 2007 – eASIC Corporation, a provider of Structured ASIC devices and Configurable logic IP, and MoreThanIP GmbH, a leading supplier of networking IP cores, today announced the immediate availability of a Tri-Mode (10/100/1000) Ethernet MAC […]



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Jan 24, 2007

eASIC Teams With CAST To Deliver ARM926EJ AMBA Compliant Peripherals for 90nm Nextreme Structured ASICs

CAST joins eASIC’s newly established eZ-IP Alliance program Santa Clara, California, January 11, 2007 – eASIC Corporation, a provider of Structured ASIC devices and Configurable Logic IP, today announced the availability of ARM AMBA Platform IP (PIP-AMBA) from CAST for eASIC’s 90nm Nextreme Structured ASIC product family. CAST, who joined the company’s newly established eZ-IP […]



eASIC Engages Si-Edge to Provide Additional Advanced Design Center Support in China for eASIC’s Custom IC Platform

Sep 6, 2017

eASIC Engages Si-Edge to Provide Additional Advanced Design Center Support in China for eASIC’s Custom IC Platform

eASIC reacts to increased demand in China for its configurable custom IC’s in applications such as artificial intelligence, virtual reality, data center acceleration, data center storage and next generation communications. Santa Clara, CA – September 6, 2017 – eASIC® Corporation (@easic), a fabless semiconductor company that delivers custom integrated circuit platform solutions (eASIC Platform), today […]



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Jun 28, 2017

eASIC Recognizes Growth in Demand From China and Establishes eASIC Shenzhen WFOE

Investment Helps Support Growth in Custom IC Demand Santa Clara, CA – June, 28, 2017 – eASIC® Corporation (@easic), a fabless semiconductor company that delivers a custom integrated circuit (IC) platform (eASIC Platform), today announced the establishment of eASIC (Shenzhen) Technology Services Co. Ltd., a wholly foreign owned enterprise (WFOE) in Shenzen, China. eASIC’s business […]



eASIC and Comcores Announce Support for CPRI V7.0

May 1, 2017

eASIC and Comcores Announce Support for CPRI V7.0

Santa Clara, CA – May, 01, 2017 – eASIC® Corporation (@easic), a fabless semiconductor company that delivers a custom integrated circuit (IC) platform (eASIC Platform), and Denmark Headquartered Comcores ApS, a specialized supplier of silicon intellectual property (SIP), today announced the support of CPRI V7.0 (CPRI Specification CPRI_v_7_0 v2015-10-09) for eASIC’s Nextreme-3S family. With an […]



eASIC Participates at the Deterministic Ethernet Forum, Vienna, Austria (April 27-28, 2017)

Apr 28, 2017

eASIC Participates at the Deterministic Ethernet Forum, Vienna, Austria (April 27-28, 2017)

eASIC Nextreme Platforms Provide the Differentiated Solutions for Time Sensitive Networks (TSN) in Industrial and Automotive Markets Santa Clara, CA – April 28, 2017 – eASIC® Corporation (@easic), a fabless semiconductor company that delivers a custom integrated circuits (IC) platform (eASIC Platform) today announced its participation at the Deterministic Ethernet Forum (www.de-forum.com). The eASIC Nextreme […]



eASIC and Mobiveil Announce Flash Reliability Platform

Apr 25, 2017

eASIC and Mobiveil Announce Flash Reliability Platform

LDPC (Low Density Parity Check) Engine – Flash Error Correction Solution for the SSD Market Santa Clara, CA – April 25, 2017 – eASIC® Corporation (@easic), a fabless semiconductor company that delivers a custom integrated circuits (IC) platform (eASIC Platform), and Mobiveil, Inc., a fast growing supplier of Silicon Intellectual Properties (SIPs) and Platforms, today […]



eASIC Joins the OpenPOWER Foundation to Offer Custom-designed Accelerator Chips

May 4, 2016

eASIC Joins the OpenPOWER Foundation to Offer Custom-designed Accelerator Chips

Santa Clara, CA – May 4, 2016 – eASIC® Corporation (@easic), a fabless semiconductor company that delivers a custom integrated circuit (IC) platform (eASIC Platform) today announced it has joined the OpenPOWER Foundation, an open development community based on the POWER microprocessor architecture. eASIC joins a growing roster of technology organizations working collaboratively to build […]



eASIC Enables Improved Real-Time<br>Hardware Acceleration Performance<br>for ASOCS’ Fully Virtualized RAN (vRAN) Solution

Feb 23, 2016

eASIC Enables Improved Real-Time
Hardware Acceleration Performance
for ASOCS’ Fully Virtualized RAN (vRAN) Solution

eASIC Nextreme-3 used by ASOCS to obtain higher performance and lower power consumption for its Gen3 hardware acceleration platform over its Gen2 Pure FPGA Based System SANTA CLARA, Calif. – 23 February, 2016 – eASIC® Corporation (@easic), a fabless semiconductor company that delivers a custom integrated circuit (IC) platform (eASIC Platform), and ASOCS Ltd., a […]



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Dec 7, 2015

eASIC Reports Continued Revenue Growth and Record Profitability

Company completes fifth consecutive quarter of non-GAAP profitability and withdraws S1 filing SANTA CLARA, Calif. – December 3, 2015 – eASIC® Corporation (@easic), a fabless semiconductor company that delivers custom IC solutions comprising, the eASIC platform and standard ASICs, today announced that revenues for the nine months ended September 30, 2015 grew 18% over the […]



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Sales Contacts

Americas eASIC Corporation 3940 Freedom Circle, Santa Clara, CA 95054, USA Telephone: 408-855-9200 sales@easic.com www.easic.com   30 Cabrillo Terrace Aliso Viejo, CA 92656, USA Telephone: 949-716-5877 caihara@easic.com www.easic.com Thorson Rocky Mountain 9090 Ridgeline Blvd., Suite 230, Highlands Ranch, CO 80129, USA Telephone: 303-773-6300 www.thorsonrm.com Europe Axellence GmbH Joh.-G.-Gutenberg-Str. 19 e/f, D-82140 Olching, Germany Telephone: +49-8142-441-899 […]



eASIC and ASOCS Partner to Develop Custom Silicon Accelerators for  Network Function Virtualization (NFV)-based Virtual Base Station Solutions

Aug 24, 2015

eASIC and ASOCS Partner to Develop Custom Silicon Accelerators for Network Function Virtualization (NFV)-based Virtual Base Station Solutions

Agreement Exemplifies eASIC’s Commitment to Deliver Custom Silicon for Improved Performance-Per-Watt Acceleration SANTA CLARA, Calif. – August 24, 2015 – eASIC® Corporation (@easic), a fabless semiconductor company that delivers a custom integrated circuit (IC) platform (eASIC Platform), and ASOCS, Ltd., a pioneer in virtual radio access networks (vRAN) and provider of fully virtualized network function […]



eASIC and Tamba Networks Announce Immediate Availability of 100 Gigabit Ethernet Solution for Data Center, Core and Access Network Switching Applications

Aug 17, 2015

eASIC and Tamba Networks Announce Immediate Availability of 100 Gigabit Ethernet Solution for Data Center, Core and Access Network Switching Applications

SANTA CLARA, Calif. – August 17, 2015 – eASIC Corp. (@easic), a fabless semiconductor company that delivers a custom integrated circuit (IC) platform (eASIC Platform), and Tamba Networks, a leading developer of connectivity IP cores, today announced the immediate availability of a 100 Gigabit Ethernet MAC (media access controller) and PCS (physical coding sublayer) solution […]



eASIC and Comcores Deliver CPRI v6.1 Switch Reference Design  for Next-Generation LTE Advanced and 5G Networking Equipment

Jun 16, 2015

eASIC and Comcores Deliver CPRI v6.1 Switch Reference Design for Next-Generation LTE Advanced and 5G Networking Equipment

SANTA CLARA, Calif. – June 16, 2015 – eASIC Corporation (@easic), a fabless semiconductor company that delivers a custom integrated circuit (IC) platform (eASIC Platform), and Comcores ApS, a leading provider of IP cores for wireless networks and an eZ-IP Alliance Partner, today announced immediate availability of a common public radio interface (CPRI) v6.1 switch […]



eASIC Licenses Mobiveil’s Universal Multiport Memory Controller IP

Jun 9, 2015

eASIC Licenses Mobiveil’s Universal Multiport Memory Controller IP

Availability of Silicon-Proven, Standards-Compliant IP on eASIC Platform Reduces Time-to-Market for Chip Designers. Milpitas CA – June 9, 2015 – Mobiveil, Inc., a fast growing supplier of silicon intellectual property, today announced that eASIC has licensed Mobiveil’s Universal Multiport Memory Controller (UMMC) IP. Designers using the custom IC (integrated circuit) eASIC Platform now have access […]



Intel, eASIC Collaborate on Customized Intel-Based Solutions  for the Cloud

May 12, 2015

Intel, eASIC Collaborate on Customized Intel-Based Solutions for the Cloud

Companies Plan to Deliver Custom Intel® Xeon® Processors with eASIC Platforms to Speed Workloads like Security, Big Data, and Other Applications. Santa Clara, CA, May 12, 2015 – Intel Corporation today announced plans to develop integrated products with eASIC Corporation that combine processing performance and customizable hardware to meet the increasing demand for custom compute […]



eASIC Joins Hybrid Memory Cube Consortium

Apr 7, 2015

eASIC Joins Hybrid Memory Cube Consortium

Santa Clara, CA – April 7, 2015 – eASIC Corporation, (@easic) a fabless semiconductor company that delivers a custom integrated circuit (IC) platform (eASIC Platform), today announced that it has joined the Hybrid Memory Cube Consortium. The organization includes more than 150 members dedicated to the development and establishment of an industry-standard interface specification for […]



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Mar 16, 2015

eASIC, China Mobile Research, Telenor Research and ASOCS Discuss Making NFV C-RAN a Reality in 2015

Santa Clara, CA – March 16, 2015 – eASIC Corporation, (@easic) a fabless semiconductor company that delivers a custom integrated circuit platform (eASIC Platform) today announced its sponsorship of a Light Reading webinar with China Mobile Research Institute, Telenor Research, ASOCS Ltd. Heavy Reading analyst and panel moderator, Simon Stanley, will lead a discussion of […]



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Mar 5, 2015

eASIC Passes Milestone of Shipping Twenty Million Custom ICs

Santa Clara, CA – March 5, 2015 – eASIC Corporation, (@easic) a fabless semiconductor company that delivers a custom integrated circuit (IC) platform (eASIC Platform), today announced that it has shipped over twenty million custom ICs. eASIC custom ICs are used by electronics companies that need the right combination of fast time to market, high […]



eASIC and Comcores Announce Availability of <br/>CPRI v6.1

Mar 2, 2015

eASIC and Comcores Announce Availability of
CPRI v6.1

Santa Clara, CA – March 2, 2015 – eASIC Corporation, (@easic) a fabless semiconductor company that delivers a custom integrated circuits (IC) platform (eASIC Platform), and Denmark Headquartered Comcores ApS, a specialized supplier of silicon intellectual property (SIP) today announced the immediate availability of the Common Public Radio Interface (CPRI) v6.1 for eASIC’s Nextreme-3 28nm […]



eASIC and Xelic Deliver CPRI to OTN Reference Design For SFP+  to Enable Fast C-RAN Deployment

Dec 17, 2014

eASIC and Xelic Deliver CPRI to OTN Reference Design For SFP+ to Enable Fast C-RAN Deployment

Santa Clara, CA – December 17, 2014 – eASIC Corporation, (@easic) a fabless semiconductor company that delivers a custom IC platform (eASIC Platform), and Xelic, Inc., a fast leading supplier of silicon intellectual property (SIP) and IP-enabled design services, today announced the immediate availability of a CPRI to OTN reference design implemented in the eASIC […]



eASIC Announces 12.5Gbps JESD204B Interoperability Testing With Texas Instruments

Dec 15, 2014

eASIC Announces 12.5Gbps JESD204B Interoperability Testing With Texas Instruments

Interoperability enables eASIC OEMs to quickly adapt their radio platforms without compromising bandwidth, power consumption or cost Santa Clara, CA – December 15, 2014 – eASIC Corporation (@easic), a fabless semiconductor company delivering a custom IC platform (eASIC Platform), today announced that it has successfully completed JESD204B interoperability at 12.5 Gbps between its eASIC Nextreme-3 […]



eASIC Demonstrates 10Gbps JEDEC JESD204B

Dec 8, 2014

eASIC Demonstrates 10Gbps JEDEC JESD204B

Santa Clara, CA – December 8, 2014 – eASIC Corporation, (@easic) a fabless semiconductor company delivering a custom IC platform (eASIC Platform) announced today that it has successfully completed JESD204B interoperability at 10 Gbps lane rates. Analog Devices’ AD9234 12-bit, 1.0-GSPS high-speed dual analog-to-digital converter (ADC) can interoperate with the eASIC Nextreme-3 28nm, which greatly […]



eASIC Corporation Will Present Energy and Bandwidth Efficient C-RAN Solutions

Oct 27, 2014

eASIC Corporation Will Present Energy and Bandwidth Efficient C-RAN Solutions

Barcelona, Spain – October 27, 2014 Presentation will review common implementation challenges and provide details on effective solutions. Who eASIC Corporation, a leading provider of Single Mask Adaptable ASIC devices will be represented by Dr. Christian Lanzani, the Director for Wireless at eASIC, responsible for the overall wireless strategy including radio access, fronthaul connectivity, baseband […]



Huawei Selects eASIC for Transport Network Backhaul

Oct 26, 2014

Huawei Selects eASIC for Transport Network Backhaul

Santa Clara, CA – October 27, 2014 – eASIC Corporation, a leading provider of Single Mask Adaptable ASIC devices, today announced that Huawei is using eASIC’s Nextreme-3 28 nm devices to meet the increased system performance and aggressive costs required by Transport Network Products. Due to the increased throughput, Transport Networks require twice the clock […]



eASIC and Comcores Announce Support for C-RAN with CPRI v6.0

Oct 13, 2014

eASIC and Comcores Announce Support for C-RAN with CPRI v6.0

Santa Clara, CA – October 13th, 2014 – eASIC Corporation, a leading provider of Single Mask Adaptable ASIC™ devices, and Denmark Headquartered Comcores ApS, a specialized supplier of silicon intellectual property (SIP), today announced immediate support for Common Public Radio Interface (CPRI) v.6.0 using eASIC’s Nextreme-3 28 nm devices enabling energy efficient and high-performance wireless […]



eASIC Joins Open NAND Flash Interface (ONFi) Working Group

Sep 15, 2014

eASIC Joins Open NAND Flash Interface (ONFi) Working Group

Santa Clara, CA – September 15, 2014 – eASIC Corporation®, the leading provider of Single Mask Adaptable ASIC™ devices today announced that it has joined the Open NAND Flash Interface (ONFi) working group, an organization of industry-leading companies dedicated to simplifying the integration of NAND flash memory into consumer electronics devices, computing platforms and industrial […]



Mobiveil Joins eASIC eZ-IP Alliance Program

Jun 16, 2014

Mobiveil Joins eASIC eZ-IP Alliance Program

Santa Clara, CA – June 16, 2014 – eASIC Corporation, a leading provider of Single Mask Adaptable ASIC™ devices and Mobiveil, Inc. a fast growing supplier of silicon intellectual property (SIP), and IP-enabled design services, today announced that Mobiveil has joined eASIC’s eZ-IP alliance program. With this partnership, Mobiveil’s portfolio of silicon-proven high speed serial […]



1200 Processor

May 22, 2014

1200 Processor

Free 32-bit processor Harvard architecture Very silicon efficient Multiple instantiation possible on eASIC Nextreme Structured ASIC Supported by open source software GNU tools Id GNU Compiler As GNU Assembler GDB GNU Debugger



LEON3 Processor

LEON3 Processor

SPARC V8 instruction set with V8e extensions Advanced 7-stage pipeline Hardware multiply, divide and MAC units High-performance, fully pipelined IEEE-754 FPU Separate instruction and data cache (Harvard architecture) with snooping Configurable caches: 1 – 4 sets, 1 – 256 kbytes/set. Random, LRR or LRU replacement Local instruction and data scratch pad rams SPARC Reference MMU […]



Ethernet 10/100/1000

Ethernet 10/100/1000

Full Featured Tri-Mode, 10/100 and Gigabit MAC with integrated FIFO All Modes at all speeds UNH certified Silicon Proven on eASIC Nextreme™ 90nm NEW ASIC



FFT/iFFT

FFT/iFFT

Performance up to the 300 MHz max in eASIC Nextreme-II Devices Performance up to the 190 MHz max in eASIC Nextreme Devices Maximum Throughput of 90 MSPS in eASIC Nextreme-II and 54 MSPS in eASIC Nextreme Transform sizes from 8 to 16K points with the option to be run-time programmable Two architectural implementation options providing […]



eASIC Announces Support for GigaChip Interface

May 13, 2014

eASIC Announces Support for GigaChip Interface

eASIC and MoSys demonstrate 12.5 Gbps interoperability between eASIC Nextreme-3 and MoSys Bandwidth Engine IC. Santa Clara, CA – May 13, 2014 – eASIC® Corporation, a leading provider of Single Mask Adaptable ASIC™ devices and MoSys, Inc., a leader in semiconductor solutions that enable fast, intelligent data access for network and communications systems, today announced […]



eZ-IP Intellectual Property Alliance

eZ-IP Intellectual Property Alliance

eASICs eZ-IP™ Alliance program aims to rapidly bring a wealth of fully verified eASIC ready IP cores to help you to get to market faster. Our partners are amongst the most experienced IP developers in the industry that have been carefully chosen to provide the highest quality IP cores in every aspect – from design […]



easicopy Cell-based ASIC Migration Path

easicopy Cell-based ASIC Migration Path

easicopy™ ASIC provides OEMs with a seamless path from a eASIC’s Nextreme-3, Nextreme-2 or Nextreme devices to a cell-based easicopy ASIC, thereby enabling OEMs to further reduce device cost and power consumption, or increase performance. The eASIC Continuum With eASIC as a partner, OEMs have multiple solutions for cost reduction that can provide the optimum […]



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Products Overview

The eASIC Nextreme is a family of Platforms, manufactured on 28 nm, 45 nm and 90 nm CMOS processes, and built using eASIC’s patented single-via customization technology. The eASIC Nextreme family provides ASIC-like performance, power and low unit-cost combined with FPGA-like design flow, low NRE charges and rapid delivery of devices. eASIC Nextreme Family Overview […]



NEC uses eASIC to Optimize iPasolink Microwave Products

Apr 14, 2014

NEC uses eASIC to Optimize iPasolink Microwave Products

Santa Clara, CA – April 14th, 2014 – eASIC® Corporation, a provider of Single Mask Adaptable ASIC™ devices today announced that NEC Corporation, a provider of leading solutions in the microwave backhaul market, is using eASIC’s Nextreme-2 product to optimize the performance and power of key functionality in their iPasolink backhaul products.



eASIC and CST Reduce Multi-Level Package Design and Simulation Time by up to 5x

Oct 28, 2013

eASIC and CST Reduce Multi-Level Package Design and Simulation Time by up to 5x

eASIC and Computer Simulation Technology (CST) to demonstrate up to 5x reduction in co-simulation time for multi-level PCB package design Santa Clara, CA – October 28, 2013 – eASIC® Corporation, a leading provider of Single Mask Adaptable ASIC™ devices and Computer Simulation Technology (CST) have teamed up to significantly reduce multi-level PCB package design and […]



VMC uses eASIC to Achieve 24.756 TH/s Bitcoin Miner

Sep 4, 2013

VMC uses eASIC to Achieve 24.756 TH/s Bitcoin Miner

VMC develops single mask ASIC using 28nm eASIC Nextreme-3 to significantly increase performance while reducing power consumption Santa Clara, CA and Springfield, MO – September 4, 2013 – eASIC® Corporation, a leading provider of single mask ASIC devices and Virtual Mining Corporation (VMC) today announced that VMC will use eASIC Nextreme-3™ 28nm devices to create […]



eASIC Announces Strategic Investment by Seagate

Aug 5, 2013

eASIC Announces Strategic Investment by Seagate

Seagate makes equity investment in eASIC Cupertino, CA and Santa Clara, CA – August 5, 2013 – eASIC Corporation, a provider of NEW ASIC devices today announced a strategic investment by Seagate Technology (NASDAQ:STX). In addition to the equity investment, eASIC and Seagate also are exploring opportunities to jointly develop custom silicon solutions for Seagate’s […]



Kevin Rowett, vice president of Engineering, Violin Memory Inc.

Feb 27, 2013

Kevin Rowett, vice president of Engineering, Violin Memory Inc.

We looked at a number of ASIC platform choices for implementing our custom FLASH controllers. We opted to collaborate with eASIC for reducing cost and power consumption because their Nextreme-2T NEW ASICs enabled us to quickly migrate from FPGAs, and inexpensively ramp our solutions to high volume production.



Violin Memory Selects eASIC for Flash Memory Arrays

Violin Memory Selects eASIC for Flash Memory Arrays

SANTA CLARA, CA, – February 27, 2013 – eASIC Corporation, a provider of NEW ASIC devices, today announced that Violin Memory, provider of one of the world’s fastest and most scalable FLASH memory arrays, has selected eASIC’s Nextreme-2T NEW ASICs for implementing FLASH controllers for its latest 6000 Series enterprise-grade FLASH memory arrays.



eASIC and Proton Digital Systems Announce LDPC NAND FLASH Read Channel For Enterprise Storage

Dec 17, 2012

eASIC and Proton Digital Systems Announce LDPC NAND FLASH Read Channel For Enterprise Storage

eASIC-based LDPC Solution Enables Approximately 2X Higher Performance and Half The Power Compared to FPGAs Based Solutions Santa Clara, CA – December 17, 2012 – eASIC Corporation, a provider of NEW ASIC devices, and Proton Digital Systems, a provider of FLASH Memory Reliability IP Solutions, today announced the immediate availability of an LDPC (Low Density […]



eASIC Rated Third Fastest Growing Semiconductor Company in North America on Deloitte’s 2012 Technology Fast 500

Nov 14, 2012

eASIC Rated Third Fastest Growing Semiconductor Company in North America on Deloitte’s 2012 Technology Fast 500

Attributes 980 Percent Revenue Growth to Rapid Adoption of eASIC Devices within Major OEM Customers Santa Clara, CA – November 14, 2012 – eASIC Corporation, a provider of NEW ASICs, today announced that it is rated the third fastest growing semiconductor company on Deloitte’s Technology Fast 500™, a ranking of the 500 fastest growing technology, […]



eASIC Enables 3X Increase in Energy Efficiency for Astrophysical Simulation Supercomputer

May 2, 2012

eASIC Enables 3X Increase in Energy Efficiency for Astrophysical Simulation Supercomputer

Santa Clara, CA – May 2nd, 2012 – eASIC Corporation, a provider of NEW ASIC devices, today announced that Tokyo Institute of Technology, in collaboration with Hitotsubashi University, has successfully demonstrated a 3X increase in energy efficiency for a green supercomputer used for performing astronomical simulations. By leveraging eASIC´s low power Nextreme-2 NEW ASIC devices, […]



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Feb 27, 2012

eASIC Surpasses 3 Million Chips Shipped and is set to Double This in 2012

Santa Clara, CA – February 27, 2012 – eASIC Corporation, a provider of NEW ASIC devices, today announced that it has shipped in excess of three million chips and achieving this shipment milestone firmly solidifies eASIC’s position as a high volume supplier of custom integrated circuits. eASIC expects to be at more than double that […]



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Jan 30, 2012

eASIC Grows 2011 Revenue by 80%

Santa Clara, CA – January 30, 2012 – eASIC Corporation, a provider of NEW ASIC devices, today announced 80% growth in sales revenue from calendar year 2010 to 2011. The majority of the revenue in 2011 was split between wireless infrastructure and storage markets. However, other applications also contributed to the revenue. At the end […]



Kurt Richarz, Seagate Executive Vice President of Sales

May 25, 2011

Kurt Richarz, Seagate Executive Vice President of Sales

Seagate is delighted to have launched Momentus®XT, the industry’s first solid state hybrid drive, using the easicopy ASIC Migration product. We were able to use Nextreme NEW ASICs to accelerate time-to-market of Momentus®XT. eASIC seamlessly migrated our design to easicopy™. We see easicopy™ as a natural extension to our value engineering programs as we take […]



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eASIC Announces easicopy ASIC

New Product Mitigates Traditional Risks of Cell-based ASIC Design Santa Clara, CA – May 25, 2011 – eASIC Corporation today announced the immediate availability of “easicopy™”, an ASIC migration product that provides custom chip designers with a simple, low-risk migration path from eASIC Nextreme and Nextreme-2 NEW ASICs to cell-based ASIC devices.The addition of easicopy™ […]



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Dec 7, 2010

eASIC Introduces 45nm ASIC Value Shuttle™ Program

New Value Shuttle™ Delivers 45nm NEW ASIC Prototypes for $45K Santa Clara, CA – December 7, 2010 – eASIC Corporation, a provider of NEW ASIC devices, today introduced a Value Shuttle™ program that lowers the entry cost for 45nm ASIC designs. The 45nm Value Shuttle™ enables designers to receive forty-five (45) eASIC Nextreme-2 NEW ASIC […]



eASIC and Radiocomp Deliver Low Power 6G CPRI v4.1 REC Solution

Nov 9, 2010

eASIC and Radiocomp Deliver Low Power 6G CPRI v4.1 REC Solution

Power Consumption of CPRI-based Designs Reduced by up to 80%, With exceptionally High Signal Integrity Compared to FPGA Implementations Santa Clara, CA, November 9, 2010 — eASIC Corporation, a supplier of NEW ASICs and Radiocomp, a leading provider of modular RF systems and components for mobile and wireless infrastructure networks, today announced the immediate availability […]



eASIC Enables Early Rollout of On-Ramp Wireless’ eNODE Solutions

Oct 5, 2010

eASIC Enables Early Rollout of On-Ramp Wireless’ eNODE Solutions

eASIC Nextreme NEW ASICs Accelerate Adoption of Wireless Solutions for Smart Grid, Remote Sensing and Location Tracking Systems SANTA CLARA, CA, – October 5, 2010 – eASIC Corporation, a provider of NEW ASIC devices, today announced that On-Ramp Wireless, Inc., a provider of low-power, wide area scalable wireless networking systems successfully rolled out its eNode […]



Mr. Dai Vu, Director of Virtualization Solutions Marketing, Microsoft Corp.

May 13, 2010

Mr. Dai Vu, Director of Virtualization Solutions Marketing, Microsoft Corp.

By working with eASIC’s Nextreme NEW ASIC, we were able to develop a reference design for RemoteFX hardware solutions that is low in power consumption as well as low in up-front development cost. “We see eASIC’s Nextreme as a platform well suited for our efforts to quickly validate new technologies, but also as a catalyst in enabling our RemoteFX […]



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May 5, 2010

eASIC eTools 8.1 Design Suite Reduces Design Time by 40%

New eTools 8.1 Enables Designers to Achieve up to 30% Higher Performance in 40% Less Time Santa Clara, CA – May 5, 2010 – eASIC Corporation, a provider of NEW ASIC devices, today announced the immediate availability of its eTools 8.1 Design Suite for implementing 45nm eASIC Nextreme-2 designs. The eTools 8.1 tool suite delivers […]



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Jan 21, 2010

eASIC Slashes Power With Low Voltage Device

New Devices Reduce Power Consumption up to 40% Santa Clara, CA – January 21, 2010 – eASIC Corporation, today announced the immediate availability of two new lower power device options for its eASIC Nextreme Family. The NX750LP and NX750 eASIC Nextreme devices are now available with operating voltage down to 1.0V thereby enabling designers to […]



Sunny Ng, Aurora Systems

Jan 18, 2010

Sunny Ng, Aurora Systems

eASIC’s Nextreme devices offered us the only solution to meet the stringent cost, performance and power requirements for our consumer digital video products. We were extremely impressed with the fast turnaround time and low up front cost. I am not surprised that eASIC has rapidly reached this impressive milestone. We are privileged to be the […]



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Masato Tsuru, FLEETS

Using eASIC Nextreme devices together with our SiP technologies, we were able to significantly speed up the product development cycle, achieving our target performance and moreover, saving the NRE cost. These benefits allowed us to get to market with a functioning board, on schedule and on budget.



Douglas (Doug-Myoung) Lee, NexusChips

Douglas (Doug-Myoung) Lee, NexusChips

With eASIC’s Nextreme, we were able to achieve 2X higher performance at 1/5th the power of our Xilinx Virtex-4 FPGA. This was crucial for securing our design win for our graphics acceleration system



Pierre Boulanger, FLIR Systems, CVS Division

Pierre Boulanger, FLIR Systems, CVS Division

We successfully ported an existing production FPGA design to eASIC’s Nextreme, validating the power savings, tools suite effectiveness, cost, scheduling and support. All were validated with flying colors, making us eager to proceed to the next phase.



John Goodacre, ARM Processor Division

John Goodacre, ARM Processor Division

We were able to develop our eASIC device in a reduced time and cost of a standard cell ASIC and with development costs that were even lower than an FPGA approach and the eASIC device worked right first time on our PBX-A9 validation and development board. We see the 90nm eASIC Nextreme  technology as a […]



Mr. Shigenori Shibue, Mitsubishi Electric Corporation, Kyoto Works

Jan 13, 2010

Mr. Shigenori Shibue, Mitsubishi Electric Corporation, Kyoto Works

We are excited to have a path to developing ASIC solutions quickly that are low in up-front development cost, quick to develop and gets us to market in rapid time to fully exploit our market opportunities. “We see eASIC’s Nextreme as a platform that we can use to create new high performance product derivatives quickly […]



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Nov 16, 2009

eASIC Introduces eTools 8.0

New eTools 8.0 Software Simplifies 45nm ASIC Design Santa Clara, CA – November 16, 2009 – eASIC Corporation, a provider of NEW ASIC devices, today announced the immediate availability of its eTools 8.0 software suite for implementing 45nm eASIC Nextreme-2 designs. The eTools 8.0 tool suite delivers a robust ASIC grade design flow with the […]



Mitsubishi Electric Selects eASIC for Display Wall Cubes

Oct 28, 2009

Mitsubishi Electric Selects eASIC for Display Wall Cubes

eASIC Nextreme NEW ASICs Enhance Video System Performance by 50% Santa Clara, CA – October 28, 2009 – eASIC Corporation, a provider of NEW ASIC devices, today announced that Mitsubishi Electric Corporation (Kyoto Works), a leading global manufacturer of display wall systems, has selected eASIC’s Nextreme NEW ASICs for its Seventy Series Display Wall Cube […]



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Sep 28, 2009

eASIC Announces NEW ASIC-in-a-Box Design Kits

Design Kits Significantly Simplify ASIC Design Santa Clara, CA- September 28, 2009 – eASIC Corporation, a provider of NEW ASIC devices, today announced the immediate availability of two ASIC-in-a-Box design kits that enable ASIC design to be widely accessible and thereby reverse the trend of declining ASIC design starts. Through simplifying the design flow, the […]



ARM Utiliizes eASIC Devices to Validate Cortex-A9 MPcore Multicore Processor-Based Devices

Jun 10, 2009

ARM Utiliizes eASIC Devices to Validate Cortex-A9 MPcore Multicore Processor-Based Devices

eASIC Nextreme NEW ASIC Delivers High Performance, low cost Solution for at Speed Verification Santa Clara, CA – June 10, 2009 – eASIC Corporation, a provider of low up-front development cost NEW ASICs, today announced that ARM [(LSE:ARM);(Nasdaq:ARMH)] has successfully validated it’s next-generation Cortex™-A9 MPCore™ multicore processor using eASIC’s Nextreme NEW ASICs. With eASIC Nextreme, […]



eASIC Accelerates DSP Market Momentum with new IP Cores

May 6, 2009

eASIC Accelerates DSP Market Momentum with new IP Cores

FFT and FIR Compiler Cores from eASIC and Steepest Ascent Simplify Migration of FPGA-based DSP designs Santa Clara, CA – May 6, 2009 – eASIC Corporation, a provider of NEW ASIC devices, today announced the immediate availability of two new DSP IP cores, an FFT and FIR Filter Compiler, to accelerate it’s growing momentum into […]



eASIC and Video-cores Deliver low-cost Video IP Dolutions

Nov 10, 2008

eASIC and Video-cores Deliver low-cost Video IP Dolutions

New Intellectual Property (IP) Blocks Reduce Cost and Accelerate Time to Market for eASIC Nextreme NEW ASICs Santa Clara, CA – November 10, 2008 – eASIC Corporation, a provider of zero-mask charge ASIC devices, and Video-Cores, a provider of high-performance media IP cores, today announced the immediately availability of proven video IP cores for eASIC’s […]



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Aug 4, 2008

eASIC Delivers 45nm Zero Mask-charge New eASIC Family

eASIC Nextreme-2 New ASIC Family Aimed At Reversing Decline of Worldwide ASIC Design Starts Santa Clara, CA – August 4, 2008 – Leveraging the rapid success of its award winning 90nm eASIC Nextreme ASIC Products, eASIC Corporation today announced its next generation eASIC Nextreme-2 Family – the semiconductor industry’s first 45nm, zero mask-charge New ASIC […]



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Jul 17, 2008

eASIC Announces eDiVeo Family of low-cost Single-chip Audio and Video Codecs

Configurable Architecture Permits Rapid Deployment of Audio and Video CODEC ICs Supporting MPEG-4, JPEG and H.264 Standards Santa Clara, CA – July 17, 2008 – eASIC Corporation (www.eASIC.com), a provider of zero mask-charge ASIC devices, today announced the immediate availability of the eDV9100, the first member of it’s eDiVeo family of low-cost single chip audio […]



eASIC Enables Nexus Chips to Reduce Power Consumption by 80% Over FPGAs

Jul 8, 2008

eASIC Enables Nexus Chips to Reduce Power Consumption by 80% Over FPGAs

eASIC’s Zero Mask-charge ASIC Devices Enable Nexus Chips to Increase Performance by 2X and Reduce FPGA Power Consumption by 80% for 3D Video Applications Santa Clara, CA – July 8, 2008- eASIC Corporation, a provider of zero mask-charge ASIC devices, today announced that Nexus Chips, a leading Korean provider of graphics acceleration solutions, has leveraged […]



eASIC and Northwest Logic Deliver low Cost, Silicon-proven, 533 mbps DDR2 SDRAM Solution

Jun 30, 2008

eASIC and Northwest Logic Deliver low Cost, Silicon-proven, 533 mbps DDR2 SDRAM Solution

eASIC Based DDR2 SDRAM Solution Provides 60% Higher Performance than Mainstream Low-Density FPGAs Santa Clara, CA – June 30, 2008 – eASIC Corporation, a provider of zero-mask charge ASIC devices, and Northwest Logic, a provider of high-performance IP Cores, today announced the immediately availability of a silicon-proven 533 Mbps DDR2 SDRAM solution for eASIC’s low-cost […]



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Jun 2, 2008

eASIC Turns 100

eASIC Zooms Past 100th 90nm ASIC Design Win in 18 Months Santa Clara, CA -2 June, 2008 – eASIC Corporation, a provider of zero mask-charge ASIC devices, today announced that it has surpassed 100 design wins in only 18 months for it’s eASIC Nextreme family of 90nm ASIC devices. These design wins demonstrate rapid adoption […]



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May 27, 2008

eASIC Appoints Distinguished ASIC Expert DR. Ranko Scepanovic as Senior Vice President of Advanced Technology

New Senior Vice President to Lead Advanced Technology Development of Zero Mask-charge ASICs. Santa Clara, CA – May 27, 2008 – eASIC Corporation, a provider of zero mask-charge ASIC devices, today announced it has appointed Dr. Ranko Scepanovic as Senior Vice President of Advanced Technology. Dr. Scepanovic will lead the companies Advanced Technology Group and […]



eASIC Shatters FPGA Performance With 235MHz LEON3 Processor

Apr 14, 2008

eASIC Shatters FPGA Performance With 235MHz LEON3 Processor

Gaisler Research Joins eASIC’s Growing eZ-IP Alliance Program to Provide Higher Performance LEON3 SPARC Soft Processor using eASIC Nextreme Zero Mask-Charge ASICs Santa Clara, CA – April 14, 2008 – eASIC Corporation, a provider of zero-mask charge ASIC devices, today announced the immediate availability of Gaisler Research’s LEON3 SPARC Soft Processor. eASIC and Gaisler Research […]



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Apr 10, 2008

eASIC Appoints ASIC and FPGA Industry Expert, MO MOVAHED as Vice President of Software Engineering

eASIC Attracts New Vice President to Lead Software Development for Next Generation Silicon Products Santa Clara, CA – April 10, 2008 – eASIC Corporation, a provider of zero mask-charge ASIC devices, today announced it has appointed Mo Movahed as Vice President of Software Engineering. Movahed will spearhead the development of design tools and methodologies for […]



eASIC Enables AVTECH to Reduce IP Surveillance Camera Cost by 45%

Mar 25, 2008

eASIC Enables AVTECH to Reduce IP Surveillance Camera Cost by 45%

eASIC’s Zero Mask-Charge ASIC Delivers Increased Functionality at Significantly Lower Cost than a Low Density FPGA Santa Clara, CA – March 25, 2008 – eASIC Corporation, a provider of zero-mask charge ASIC devices, today announced that AVTECH, a leading Taiwanese manufacturer of low cost surveillance systems, reduced the system cost of its new dome IP […]



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Mar 18, 2008

eASIC Corporation Announces a Landmark Program Aimed at Ushering in an era of Affordable Silicon Customization

First Phase of Program Enables Cost Reduction of Low Density FPGAs Santa Clara, California, March 18, 2008 – eASIC Corporation, a provider of zero-mask charge ASIC devices, today announced the first phase of a worldwide program that is aimed at ushering in a new era of affordable silicon customization. The first step in this far-reaching […]



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Mar 13, 2008

eASIC Raises $48 Million in Latest Financing Round

eASIC Raises Largest Round To Date To Fund Product Deployment, Customer Support and Next Generation Product Release Santa Clara, California (March 13, 2008)–eASIC Corporation, a provider of zero mask-charge ASIC chips, today announced it has raised $48M in late stage financing. The financing round was lead by Advanced Equities Incorporated. Also participating in the round […]



eASIC and Tensilica Partnership Delivers Free Diamond Processors

Nov 26, 2007

eASIC and Tensilica Partnership Delivers Free Diamond Processors

Customized Tensilica-based Embedded Systems Now Available at Any Volume SANTA CLARA, CA, – November, 26, 2007 – Tensilica®, Inc and eASIC Corporation today announced a partnership to remove the cost barriers for developing custom embedded System-on-a-Chip. (SoCs). Through this partnership eASIC now provides free access to Tensilica’s Diamond Standard microprocessor and DSP cores for its […]



eASIC and Avnet ASIC Israel (AAI) Partner to Support Increasing Demand for Structured ASICs in Israel

Aug 8, 2007

eASIC and Avnet ASIC Israel (AAI) Partner to Support Increasing Demand for Structured ASICs in Israel

eASIC’s Nextreme Product Family is Added to AAI’s line-card to Combine the Benefits of FPGAs and Cell-based ASICs Santa Clara, California, and Tel Mond, Israel, August 8, 2007 – eASIC Corporation, a provider of Structured ASIC devices, and Avnet ASIC Israel (AAI), a provider of ASIC and COT design and manufacturing services, announced today a […]



Abacus Signs Innovative Structured ASIC Franchise with eASIC

Jun 25, 2007

Abacus Signs Innovative Structured ASIC Franchise with eASIC

eASIC’s Nextreme Threatens FPGA and ASIC Technologies Newbury, UK, 25 June, 2007 – Abacus Group today announced that it has signed an agreement with eASIC Corporation, a provider of Structured ASIC devices, to offer UK FPGA, ASIC and embedded systems designers with a low power consumption, low unit cost and zero NRE alternative technology.



eASIC and IAR Systems Deliver e926 Development kit for Designing low-cost, Customized ARM926EJTM Embedded Systems

May 22, 2007

eASIC and IAR Systems Deliver e926 Development kit for Designing low-cost, Customized ARM926EJTM Embedded Systems

The New kit comes Complete with Development Board and Supporting Embedded Design tools, that Enable Parallel Development of Software and Hardware for SOCs SANTA CLARA, Calif., May 22, 2007 – eASIC Corporation, a provider of Structured ASIC devices, and IAR Systems, a provider of embedded development tools, today announced the immediate availability of the e926 […]



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Apr 3, 2007

Fred N. Lancia Appointed Vice President of Sales for eASIC

With Comprehensive Experience in ASIC, FPGA and ASSP sales, in both small and large Companies, Lancia is well Suited to Service eASIC Structured ASIC Customers Santa Clara, California, April 3, 2007 – eASIC Corporation, a provider of Structured ASIC devices announced today the appointment of Fred N. Lancia II as Vice President of Sales. Reporting […]



CriticalBlue Broadens Target Silicon Platform Deployment Choices

Mar 22, 2007

CriticalBlue Broadens Target Silicon Platform Deployment Choices

Driven by customer demand, CriticalBlue’s Cascade now supports an expanded range of FPGA and Structured ASIC technologies, in addition to its traditional SoC target San Jose, California – March 22, 2007 – CriticalBlue, a provider of tools for accelerating software in embedded microprocessor applications, has announced enhanced support to its Cascade coprocessor synthesis solution for […]



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Feb 13, 2007

eASIC Expands Presence in Europe With the Addition of New Channel Partners: Chipeo of France and Si-Bahn of Germany

The cooperation will allow the channel partners to answer their customer’s needs for a low-cost and low-power configurable logic alternative Santa Clara, California, February 13, 2007 – eASIC Corporation, a provider of Structured ASIC devices and Configurable logic IP, today announced the addition of two new channel partners in Europe: Chipeo, based in France and […]



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Jan 4, 2007

eASIC’s Embedded ARM926EJ Processor is Available For All

Santa Clara, California, January 4, 2007 – eASIC Corporation, a provider of Structured ASIC devices and Configurable Logic IP, today announced the immediate availability of an ARM926EJ processor, offered in eASIC’s Nextreme 90nm product family. Now, FPGA, ASIC and System-on-Chip designers can benefit from a low-cost, fast-turnaround design with no-minimum order quantity. Under the agreement […]



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Dec 20, 2006

eASIC Strengthens Technical Ranks by Attracting Industry Luminary

Dr. Schmit, previously Associate Professor at Carnegie Mellon University, and most recently Chief Hardware Architect at Tabula Joins eASIC’s Management Team Santa Clara, California, December 20, 2006 – eASIC Corporation, a provider of Structured ASIC devices and Configurable Logic IP, today announced that Dr. Herman Schmit, previously Associate Professor in the Department of Electrical and […]



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Oct 25, 2006

eASIC expands global presence by adding new channel partners in Asia

Advinno Technologies (Singapore), Asiacom Technology (China), EE Solutions (Taiwan), Innoasic(South Korea) and Reptechnic (Australia) have signed partnership agreements to represent eASIC Santa Clara, California, October 25, 2006 – eASIC Corporation, a provider of Programmable ASIC products including Structured ASIC and Configurable Logic IP, today announced the addition of five channel partners in Asia. Singapore-based Advinno […]



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Oct 17, 2006

Dr. Ford Tamer, Senior vice president at Broadcom, joins eASIC’s board of directors

Santa Clara, California, October 17, 2006- eASIC Corporation, a provider of Programmable ASIC products including Structured ASIC and Configurable Logic IP, today announced that Dr. Ford Tamer, Senior Vice President and General Manager of the Enterprise Networking Group at Broadcom, has joined the company’s board of directors. eASIC’s management team can draw upon Tamer’s extensive […]



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Oct 11, 2006

eASIC expands in Europe by adding new channel partners

Italy based Cryptex and Sweden based ORSoC have signed partnership agreements for sales and support of eASIC’s Nextreme™ – 90nm product family Santa Clara, California, October 11, 2006 – eASIC Corporation, a provider of Programmable ASIC products including Structured ASIC and Configurable Logic IP, today announced the addition of two European channel partners. Italy based […]