eASIC Appoints Richard Heye as Chief Operating Officer
June 15, 2010
Seasoned Semiconductor Industry Executive Joins eASIC to Manage the Company Operations Ramp Through the Next Phase of Growth Acceleration
Santa Clara, CA – June 15, 2010 – eASIC Corporation, a provider of NEW ASIC devices, today announced that Richard Heye has been appointed as Chief Operating Officer (COO). Heye brings 30 years of executive management, engineering and operations experience from within the semiconductor industry. Heye is chartered with spearheading eASIC’s engineering development of, as well as, growing operations to meet the rapid customer ramp. Heye will report directly to CEO, Ronnie Vasishta.
“We look forward to the significant expansion of skills and bandwidth that Richard brings to eASIC which is going to be invaluable as move into the next phase of the company growth service many multinational multi-billion dollar customers,” commented Ronnie Vasishta, President and Chief Executive Officer at eASIC. “Richard’s operations experience is valuable as we now see a significant ramp in production on 90nm and 45nm. Also Richard’s engineering background will be essential in the release of our 28nm product.”
Previously, Heye served as the Senior Vice President of the SSD Division at SanDisk. Prior to SanDisk, Heye served as the General Manager of the Discrete Graphics Desk Top Business Unit at ATI Technologies. Previously Heye held a series of engineering, infrastructure creation and general management roles at Advanced Micro Devices (AMD), where he is credited with establishing a solid desktop, mobile and server infrastructure in the marketplace for Athlon FX, Athlon 64, and Opteron. Heye’s career also includes Director of Desktop Macintosh products at Apple Computer. Heye began his career as a designer and engineering manager within the Digital Equipment Corp. microprocessor group.
“I am excited to be joining eASIC during this period of expansive revenue growth” commented Richard Heye, eASIC COO. “I look forward to supplying the best family of products and development tools in the industry to solve our customers ever increasing challenges.”
Heye earned Bachelor Degrees in electrical engineering and computer science as well as a Masters in Computer Science from Washington University in St. Louis. He holds 3 patents.
eASIC is a fabless semiconductor company offering breakthrough NEW ASIC devices aimed at dramatically reducing the overall cost and time-to-production of customized semiconductor devices. Low-cost, high-performance and fast-turn ASIC and System-on-Chip designs are enabled through patented technology utilizing Via-layer customizable routing. This innovative fabric allows eASIC to offer a new generation of ASICs with significantly lower up-front costs than traditional ASICs.
Privately held eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Kleiner Perkins Caufield and Byers (KPCB), Crescendo Ventures, Advanced Equities Incorporated and Evergreen Partners. For more information on eASIC please visit www.eASIC.com