eASIC Enables Early Rollout of On-Ramp Wireless’ eNODE Solutions
October 5, 2010
eASIC Nextreme NEW ASICs Accelerate Adoption of Wireless Solutions for Smart Grid, Remote Sensing and Location Tracking Systems
SANTA CLARA, CA, – October 5, 2010 – eASIC Corporation, a provider of NEW ASIC devices, today announced that On-Ramp Wireless, Inc., a provider of low-power, wide area scalable wireless networking systems successfully rolled out its eNode Wireless modules six months ahead of schedule. Its fast-turnaround was facilitated by eASIC’s Nextreme NEW ASICs, which is a part of the eNODE baseband processing engine. eNODE wireless modules are used in wide area, low power and low data rate applications such as sensor monitoring, utility distribution automation, smart metering, and location tracking, to name some examples.
eASIC Nextreme NEW ASICs provide designers with a unique platform for reducing the time (and development cost) of custom chip designs, compared to traditional cell-based ASICs. Designers are able to implement designs and receive fully tested chips back in a fraction of the time, thus enabling early customer traction and market penetration. In addition to enabling fast market access, eASIC’s patented technology enables device manufacturing to start ahead of design completion. Wafers can be staged and customized late in the manufacturing cycle for unique customer designs enabling OEMs to receive tested ASIC devices in only six weeks after design tape-out.
“eASIC’s devices provided us with an inexpensive vehicle to get to market and ramp up production quickly,” commented Jonas Olsen, Vice President of Marketing at On-Ramp Wireless. “As we target many markets that are still emerging, development cost, development time, and flexibility to innovate and change quickly are critical.”
Built on On-Ramp’s Ultra-Link Processing™ (ULP) technology, the eNode is the first wireless module to provide metro-scale wireless networking in unlicensed ISM-bands. ULP also enables the system to provide a significant increase in network capacity, which substantially lowers network infrastructure and cost.
“On-Ramp’s innovative ULP signal processing technology is in high demand for a wide variety of wireless systems used for control and monitoring,” said Jasbinder Bhoot, Vice President of Marketing, eASIC Corporation. “To meet their customer demand in Smart Grid, industrial sensing and location tracking requires the ability to quickly develop cost effective solutions. eASIC’s Nextreme devices are the ideal choice when time to market and low-cost are paramount.”
eASIC is a fabless semiconductor company offering breakthrough NEW ASIC devices aimed at dramatically reducing the overall cost and time-to-production of customized semiconductor devices. Low-cost, high-performance and fast-turn ASIC and System-on-Chip designs are enabled through patented technology utilizing Via-layer customizable routing. This innovative fabric allows eASIC to offer a new generation of ASICs with significantly lower up-front costs than traditional ASICs.
Privately held eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Kleiner Perkins Caufield and Byers (KPCB), Crescendo Ventures, Advanced Equities Incorporated and Evergreen Partners. For more information on eASIC please visit www.eASIC.com
About On-Ramp Wireless
On-Ramp Wireless has developed the first wireless system purpose-built to efficiently connect billions of hard-to-reach devices in metro scale and other challenging environments. On-Ramp’s field-proven Ultra-Link Processing™ system enables low-power monitoring and control applications within Smart Grid, water efficiency, industrial sensing, and location tracking. Operating in un-licensed spectrum, our signal processing innovation finds weak signals even in high noise environments, yielding extreme coverage, immunity to high interference, and significantly lowers cost. For more information, visit www.onrampwireless.com.