eASIC nextreme

eASIC is invited to present in the disruption zone at the embedded systems conference silicon valley

March 27, 2007

eASIC to Exhibit its Disruptive Structured ASIC Technology at the Worlds Largest Embedded Design Event

Santa Clara, California, March 27, 2007 – eASIC Corporation, a provider of Structured ASIC devices has been invited by Embedded Systems Design Magazine to present its unique Structured ASIC products in the Disruption Zone at the Embedded Systems Conference Silicon Valley held at the McEnery Convention Center in San Jose, California, April 1-5, 2007. The Disruption Zone was established to focus on dynamic companies who are instigating change and driving technology in new and innovative directions. This special area will showcase only a few select companies, each of whom will present its unique technology and products to a broad audience of engineers and engineering management developing processor-based systems.

“The brightest minds in the industry convene at ESC SV with the objective of learning, networking and discussing new and innovative approaches to challenging problems faced by the embedded systems industry today,” said David Blaza, Publisher of Embedded Systems Design. “Companies such as eASIC have been selected for the Disruption Zone, to showcase the role they play in changing the face of technology and the future of the embedded industry.”

“It is very gratifying to be invited to be part of CMP’s Disruption Zone,” Said Ronnie Vasishta, eASIC President and CEO. “It is a recognition that eASIC can in fact have an industry changing influence by disrupting the traditional ways of doing custom logic design. Bringing back an era of many designs per engineer, each of which can ramp into high volume production instantaneously for no upfront cost, will stimulate innovation across the electronics industry. The recent decline in the number of ASIC and ASSP designs does not result from a decrease in the need or desire to deliver customized solutions but is rather due to the lack of a disruptive solution that could enable meeting the project requirements. A viable solution can be provided only by a disruptive technology that allows for significant cost-cut, removal of design-entry barriers, elimination of NRE, and short development time. The company who can offer quick and affordable customization to the masses holds the key for healthy semiconductor market growth in emerging consumer applications such as digital video and medical appliances.”

About eASIC

eASIC is a fabless semiconductor company offering breakthrough Structured ASIC devices aimed at dramatically reducing the overall fabrication cost and time of customized semiconductor chips. Low-cost, high-performance and fast-turn ASIC and System-on-Chip designs are enabled through patented technology of FPGA-like programmable logic coupled with ASIC-like Via-layer customizable routing. This innovative fabric efficiently employs mask-less customization with Direct-write e-Beam, and thus allows eASIC to offer zero mask-charge Structured ASICs.

Founded in 1999, eASIC Corporation is privately held, headquartered in Santa Clara, California. Investors include Vinod Khosla, Kleiner Perkins Caufield and Byers (KPCB), Crescendo Ventures, and Evergreen Partners www.eASIC.com

  • Visit eASIC at booth 3076A at the Disruption Zone, Embedded Systems Conference Silicon Valley, San Jose California, April 3-5 2007.
  • Register to attend the eASIC-ARM Free Design Tutorial on Wednesday April 4 at 2:00-3:30 p.m. at the Marriot, Almaden room, or contact info@eASIC.com
  • eASIC Press Contact

    eASIC Corporation
    Narinder Lall
    (408) 855-9200